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25X40BVSIG Datasheet

Download or read online Winbond Electronic 25X40BVSIG 1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI pdf datasheet.



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W25X10BV/20BV/40BV
1M-BIT, 2M-BIT AND 4M-BIT
SERIAL FLASH MEMORY WITH
4KB SECTORS AND DUAL I/O SPI
Publication Release Date: August 20,, 2009
- 1-
Preliminary -- Revision B

Summary of Contents

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AND 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI W25X10BV/20BV/40BV Publication Release Date: August 20,, 2009 - 1- Preliminary -- Revision B ...

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Table of Contents 1. GENERAL DESCRIPTION 2. FEATURES ... 4 3. PIN CONFIGURATION SOIC 150-MIL / 208-MIL 4. PAD CONFIGURATION WSON 6X5-MM 5. PIN CONFIGURATION PDIP 300-MIL 6. PIN DESCRIPTION SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5-MM 6.1 Package ...

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Fast Read Dual Output (3Bh) 9.2.10 Fast Read Dual I/O (BBh) 9.2.11 Continuous Read Mode Bits (M7-0) 9.2.12 Continuous Read Mode Reset (FFFFh) 9.2.13 Page Program (02h) 9.2.14 Sector Erase (20h) 9.2.15 32KB Block Erase (52h) 9.2.16 Block Erase ...

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GENERAL DESCRIPTION The W25X10BV (1M-bit), W25X20BV (2M-bit) and the W25X40BV (4M-bit) Serial Flash memories provides a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. ...

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PIN CONFIGURATION SOIC 150-MIL / 208-MIL Figure 1a. W25X10BV/20BV/40BV Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN & SS) 4. PAD CONFIGURATION WSON 6X5-MM Figure 1b. W25X10BV/20BV/40BV Pad Assignments, 8-pad WSON 6X5-mm (Package Code ZP) W25X10BV/20BV/40BV Publication ...

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PIN CONFIGURATION PDIP 300-MIL Figure 1c. W25X40BV Pin Assignments, 8-pin PDIP (Package Code DA) 6. PIN DESCRIPTION SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5-MM PIN NO. PIN NAME 1 / (IO1) 3 /WP 4 GND 5 ...

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Package Types W25X10BV/20BV/40BV are offered in an 8-pin plastic 150-mil width SOIC (package code SN) and 6x5-mm WSON (package code ZP), see figures 1a and 1b, respectively. The W25X40BV is offered in the 208-mil width SOIC (package code SS) ...

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BLOCK DIAGRAM Block Segmentation xxFF00h xxFFFFh Sector 15 (4KB) xxF000h xxF0FFh xxEF00h xxEFFFh Sector 14 (4KB) xxE000h xxE0FFh xxDF00h xxDFFFh Sector 13 (4KB) xxD000h xxD0FFh xx2F00h xx2FFFh Sector 2 ...

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FUNCTIONAL DESCRIPTION 8.1 SPI OPERATIONS 8.1.1 Standard SPI Instructions The W25X10BV/20BV/40BV are accessed through an SPI compatible bus consisting of four signals: Serial Clock (CLK), Chip Select (/CS), Serial Data Input (DI) and Serial Data Output (DO). Standard SPI ...

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WRITE PROTECTION Applications that use non-volatile memory must take into consideration the possibility of noise and other adverse system conditions that may compromise data integrity. To address this concern the W25X10BV/20BV/40BV provides several means to protect data from inadvertent ...

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CONTROL AND STATUS REGISTERS The Read Status Register instruction can be used to provide status on the availability of the Flash memory array, if the device is write enabled or disabled, and the state of write protection. The Write ...

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Status Register Protect (SRP) The Status Register Protect (SRP) bit is a non-volatile read/write bit in status register (S7) that can be used in conjunction with the Write Protect (/WP) pin to disable writes to status register. When the ...

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Status Register Memory Protection (1) STATUS REGISTER TB BP2 BP1 BP0 ...

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... Additionally, while the memory is being programmed or erased, or when the Status Register is being written, all instructions except for Read Status Register will be ignored until the program or erase cycle has completed. 9.2.1 Manufacturer and Device Identification MANUFACTURER ID Winbond Serial Flash Device ID Instruction W25X10BV W25X20BV W25X40BV ...

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Instruction Set INSTRUCTION BYTE 1 BYTE 2 NAME CODE Write Enable 06h Write Disable 04h Read Status 05h (S7S0) Register Write Status 01h S7S0 Register Read Data 03h A23A16 Fast Read 0Bh A23A16 Fast Read Dual 3Bh A23A16 ...

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Write Enable (06h) The Write Enable instruction (Figure 4) sets the Write Enable Latch (WEL) bit in the Status Register The WEL bit must be set prior to every Page Program, Sector Erase, Block Erase, Chip ...

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Read Status Register (05h) The Read Status Register instruction allows the 8-bit Status Register to be read. The instruction is entered by driving /CS low and shifting the instruction code 05h into the DIO pin on the rising edge ...

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Write Status Register (01h) The Write Status Register instruction allows the Status Register to be written. A Write Enable instruction must previously have been executed for the device to accept the Write Status Register Instruction (Status Register bit WEL ...

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Read Data (03h) The Read Data instruction allows one more data bytes to be sequentially read from the memory. The instruction is initiated by driving the /CS pin low and then shifting the instruction code 03h followed by a ...

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Fast Read (0Bh) The Fast Read instruction is similar to the Read Data instruction except that it can operate at the highest possible frequency of F eight dummy clocks after the 24-bit address as shown in figure 9. The ...

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Fast Read Dual Output (3Bh) The Fast Read Dual Output (3Bh) instruction is similar to the standard Fast Read (0Bh) instruction except that data is output on two pins, DO and DIO, instead of just DO. This allows data ...

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Fast Read Dual I/O (BBh) The Fast Read Dual I/O (BBh) instruction allows for improved random access while maintaining two IO pins, IO and similar to the Fast Read Dual Output (3Bh) instruction but with ...

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Figure 11b. Fast Read Dual I/O Instruction Sequence (Previous instruction set M5-4 10) W25X10BV/20BV/40BV Publication Release Date: August 20, 2009 - 23 - Preliminary -- Revision B ...

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Continuous Read Mode Bits (M7-0) The Continuous Read Mode bits are used in conjunction with the Fast Read Dual I/O instruction to provide the highest random Flash memory access rate with minimum SPI instruction overhead, thus allow true XIP ...

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Page Program (02h) The Page Program instruction allows up to 256 bytes of data to be programmed at previously erased to all 1s (FFh) memory locations. A Write Enable instruction must be executed before the device will accept the ...

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Sector Erase (20h) The Sector Erase instruction sets all memory within a specified sector (4K-bytes) to the erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Sector Erase Instruction ...

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Block Erase (52h) The Block Erase instruction sets all memory within a specified block (32K-bytes) to the erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Block Erase ...

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Block Erase (D8h) The Block Erase instruction sets all memory within a specified block (64K-bytes) to the erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Block Erase Instruction ...

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Chip Erase (C7h or 60h) The Chip Erase instruction sets all memory within the device to the erased state of all 1s (FFh). A Write Enable instruction must be executed before the device will accept the Chip Erase Instruction ...

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Power-down (B9h) Although the standby current during normal operation is relatively low, standby current can be further reduced with the Power-down instruction. The lower power consumption makes the Power-down instruction especially useful for battery powered applications (See ICC1 and ...

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Release Power-down / Device ID (ABh) The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to release the device from the power-down state, obtain the devices electronic identification (ID) number or do ...

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Figure 20. Release Power-down / Device ID Instruction Sequence Diagram - 32 - W25X10BV/20BV/40BV ...

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... ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code 90h followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 21 ...

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... Address bits two bits per clock. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out 2 bits per clock on the falling edge of CLK with most significant bits (MSB) first as shown in figure 22. ...

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Read Unique ID Number (4Bh) The Read Unique ID Number instruction accesses a factory-set read-only 64-bit number that is unique to each W25X10BV/20BV/40BV device. The ID number can be used in conjunction with user software methods to help prevent ...

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... The instruction is initiated by driving the /CS pin low and shifting the instruction code 9Fh. The JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 24 ...

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ELECTRICAL CHARACTERISTICS 10.1 Absolute Maximum Ratings PARAMETERS Supply Voltage Voltage Applied to Any Pin Transient Voltage on any Pin Storage Temperature Lead Temperature Electrostatic Discharge Voltage Notes: 1. Specification for W25X10BV/20BV/40BV are preliminary. See preliminary designation at the end ...

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Power-up Timing and Write Inhibit Threshold PARAMETER VCC (min) to /CS Low Time Delay Before Write Instruction Write Inhibit Threshold Voltage Note: 1. These parameters are characterized only. W25X10BV/20BV/40BV SYMBOL t (1) VSL t (1) PUW V (1) WI ...

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DC Electrical Characteristics PARAMETER SYMBOL CONDITIONS Input Capacitance C (1) IN Output Capacitance Cout Input Leakage I LI I/O Leakage I LO Standby Current Power-down Current Current Read Data / ...

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AC Measurement Conditions PARAMETER Load Capacitance Input Rise and Fall Times Input Pulse Voltages Input Timing Reference Voltages Output Timing Reference Voltages Note: 1. Output Hi-Z is defined as the point where data out is no longer driven. W25X10BV/20BV/40BV ...

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AC Electrical Characteristics DESCRIPTION Clock frequency for all instructions, except Read Data (03h) 2.7V-3.6V VCC & Industrial Temperature Clock frequency for all instructions, except Read Data (03h) 3.0V-3.6V VCC & Commercial Temperature Clock freq. Read Data instruction 03h Clock ...

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AC Electrical Characteristics ( DESCRIPTION /HOLD Active Setup Time relative to CLK /HOLD Active Hold Time relative to CLK /HOLD Not Active Setup Time relative to CLK /HOLD Not Active Hold Time relative to CLK /HOLD to Output Low-Z ...

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Serial Output Timing 10.9 Input Timing 10.10 Hold Timing W25X10BV/20BV/40BV Publication Release Date: August 20, 2009 - 43 - Preliminary -- Revision B ...

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PACKAGE SPECIFICATION 11.1 8-Pin SOIC 150-mil (Package Code SN) 8  SEATING PLANE b SYMBOL ( Notes: 1. Controlling dimensions: millimeters, ...

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SOIC 208-mil (Package Code SS) SYMBOL MIN A 1.75 A1 0.05 A2 1.70 b 0.35 C 0.19 D 5.18 D1 5.13 E 5. 7. 0° θ Notes: 1. Controlling dimensions: ...

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PDIP 300-mil (Package Code DA Symbol Min A --- A1 0.25 A2 3.18 B 0.41 B1 1. ...

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WSON (Package Code ZP)   SYMBOL MIN A 0.70 A1 0. 5.90 D2 3.35 4. (2) L 0.55 y 0.00 W25X10BV/20BV/40BV MILLIMETERS TYP. MAX MIN 0.75 0.80 0.0275 ...

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... Q R Notes: 1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications. 2. BSC Basic lead spacing between centers. 3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package. 4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad ...

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... ORDERING INFORMATION W Winbond 25X spiFlash Serial Flash Memory with 4KB sectors, Dual Outputs 40 4M-bit 20 2M-bit 10 1M-bit V 2. 8-pin SOIC 150-mil pin SOIC 208-mil DA 8-pin PDIP 300mil I Industrial (-40°C to 85° Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb Notes: 1a. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape T) or Tray (shape S), when placing orders. 1b. The “ ...

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... WSON-8 6x5mm 4M-bit DA 4M-bit PDIP-8 300mil Notes: 1. For WSON packages, the package type ZP is not used in the top side marking. W25X10BV/20BV/40BV PRODUCT NUMBER W25X10BVSNIG W25X20BVSNIG W25X40BVSNIG W25X40BVSSIG W25X10BVZPIG W25X20BVZPIG W25X40BVZPIG W25X40BVDAIG - 50 - TOP SIDE MARKING 25X10BVNIG 25X20BVNIG 25X40BVNIG 25X40BVSIG 25X10BVIG 25X20BVIG 25X40BVIG 25X40BVAIG ...

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... Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. ...

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