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PIC16F87XATI/SP Datasheet - Page 218

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PIC16F87XA
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
CH X 45°
TOP VIEW
α
A1
Dimension Limits
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Width
Molded Package Width
Exposed Pad Width
Overall Length
Molded Package Length
Exposed Pad Length
Lead Width
Lead Length
Tie Bar Width
Tie Bar Length
Chamfer
Mold Draft Angle Top
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: mMO-220
Drawing No. C04-114
DS39582C-page 218
EXPOSED
METAL
PADS
D1
D
D2
2
1
n
R
BOTTOM VIEW
A2
A
A3
Units
INCHES
MIN
NOM
MAX
n
28
p
.026 BSC
A
.033
.039
A2
.026
.031
A1
.000
.0004
.002
A3
.008 REF
E
.236 BSC
E1
.226 BSC
E2
.140
.146
.152
D
.236 BSC
D1
.226 BSC
D2
.140
.146
.152
B
.009
.011
.014
L
.020
.024
.030
R
.005
.007
.010
Q
.012
.016
.026
CH
.009
.017
.024
α
12°
Q
p
B
E2
L
MILLIMETERS*
MIN
NOM
MAX
28
0.65 BSC
0.85
1.00
0.65
0.80
0.00
0.01
0.05
0.20 REF
6.00 BSC
5.75 BSC
3.55
3.70
3.85
6.00 BSC
5.75 BSC
3.55
3.70
3.85
0.23
0.28
0.35
0.50
0.60
0.75
0.13
0.17
0.23
0.30
0.40
0.65
0.24
0.42
0.60
12°
 2001-2013 Microchip Technology Inc.

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