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PIC16F87XATI/SP Datasheet - Page 214

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PIC16F87XA
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
OPTIONAL PIN 1
INDEX ON
TOP MARKING
TOP VIEW
A1
Units
Dimension Limits
Number of Pins
Pitch
Overall Height
Standoff
Base Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Lead Width
Lead Length
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: M0-220
Drawing No. C04-103
DS39582C-page 214
EXPOSED
METAL
PAD
D
D2
2
1
n
PIN 1
INDEX ON
EXPOSED PAD
BOTTOM VIEW
A
A3
INCHES
MIN
NOM
MAX
n
44
p
.026 BSC
A
.031
.035
.039
A1
.000
.001
.002
A3
.010 REF
E
.315 BSC
E2
.262
.268
.274
D
.315 BSC
D2
.262
.268
.274
B
.012
.013
.013
L
.014
.016
.018
p
B
E2
L
MILLIMETERS*
MIN
NOM
MAX
44
0.65 BSC
0.80
0.90
1.00
0
0.02
0.05
0.25 REF
8.00 BSC
6.65
6.80
6.95
8.00 BSC
6.65
6.80
6.95
0.30
0.33
0.35
0.35
0.40
0.45
 2001-2013 Microchip Technology Inc.

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