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MCP634 Datasheet

Download or read online Microchip Technology MCP634 24 MHz, 2.5 mA Op Amps pdf datasheet.



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24 MHz, 2.5 mA Op Amps
Features:
• Gain Bandwidth Product: 24 MHz (typical)
• Short Circuit Current: 70 mA (typical)
• Noise: 10 nV/Hz (typical, at 1 MHz)
• Rail-to-Rail Output
• Slew Rate: 10 V/µs (typical)
• Supply Current: 2.5 mA (typical)
• Power Supply: 2.5V to 5.5V
• Extended Temperature Range: -40°C to +125°C
Typical Applications:
• Driving A/D Converters
• Power Amplifier Control Loops
• Barcode Scanners
• Optical Detector Amplifier
Design Aids:
• SPICE Macro Models
®
• FilterLab
Software
• Microchip Advanced Part Selector (MAPS)
• Analog Demonstration and Evaluation Boards
• Application Notes
 2009-2011 Microchip Technology Inc.
MCP631/2/3/4/5/9
Description:
The Microchip Technology, Inc. MCP631/2/3/4/5/9 fam-
ily of operational amplifiers features high gain band-
width product (24 MHz, typical) and high output short
circuit current (70 mA, typical). Some also provide a
Chip Select pin (CS) that supports a low-power mode
of operation. These amplifiers are optimized for high
speed,
low
noise
operation with rail-to-rail output and an input that
includes the negative rail.
This family is offered in single (MCP631), single with
CS pin (MCP633), dual (MCP632), dual with two CS
pins (MCP635), quad (MCP634), and quad with two
Chip Select pins (MCP639). All devices are fully speci-
fied from -40°C to +125°C.
Typical Application Circuit
R
1
V
/2
DD
R
3
V
IN
Power Driver with High Gain
and
distortion,
single-supply
R
2
V
OUT
R
L
MCP63X
DS22197B-page 1

Summary of Contents

Page 1

... This family is offered in single (MCP631), single with CS pin (MCP633), dual (MCP632), dual with two CS pins (MCP635), quad (MCP634), and quad with two Chip Select pins (MCP639). All devices are fully speci- fied from -40°C to 125°C. Typical Application Circuit ...

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... – INA INA OUTB INA INB INB V INB Table 3-1. MCP634 SOIC, TSSOP OUTD OUTA INA IND INA IND ...

Page 3

... The I specifications are for design guidance only; they are not tested. SC 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 Notice: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of ...

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... kHz 100 mV OUT P 0 P-P  GND / OUT DD 1-2). Conditions 125° V/ 0. 0.1(V /2) DD OUT V/ 0. 0.9(V /2) DD OUT DD 2009-2011 Microchip Technology Inc. / ...

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... Figure 1-2. It independently sets V CM Equation 1-1. The circuits common mode voltage )/2, not includes OST effects of temperature, CMRR, PSRR and A 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 DD Min Typ Max Units -40 125 °C A -40 125 °C ...

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... IN 100 nF MCP63X V IN k 10 k 10 k 6 FIGURE 1-2: AC and DC Test Circuit for Most Specifications. DS22197B-page REF 2.2 µF V OUT 2009-2011 Microchip Technology Inc. ...

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... Input Offset Voltage Drift (µV/°C) FIGURE 2-2: Input Offset Voltage Drift. -2.0 Representative Part -2.2 V -2.4 -2.6 -2.8 -3.0 -3.2 125°C -3.4 85°C 25°C -3.6 -40°C -3.8 -4.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 Power Supply Voltage (V) FIGURE 2-3: Input Offset Voltage vs. Power Supply Voltage with V 0V. CM 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 2.5V to 5.5V GND -1.0 Representative Part -1.2 25° 2.5V and 5.5V -1.4 DD -1.6 -1.8 -2.0 -2.2 -2.4 -2.6 -2.8 -3 ...

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... 2. 100 125 Ambient Temperature (°C) DC Open-Loop Gain 10k 100k 1.E03 1.E04 1.E05 Load Resistance ( ) DC Open-Loop Gain vs 5. CMR_H 105 125 Ambient Temperature (°C) Input Bias and Offset 2009-2011 Microchip Technology Inc. ...

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... Representative Part T 85°C A -150 V 5.5V DD -200 Common Mode Input Voltage (V) FIGURE 2-14: Input Bias and Offset Currents vs. Common Mode Input Voltage with T 85°C. A 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 2.5V to 5.5V GND 2000 1500 1000 500 0 -500 Representative Part T 125° ...

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... SS 3.5 3.0 2.5 2 2.5V DD 1.5 1.0 0.5 0.0 100 FIGURE 2-19: Supply Voltage. 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 100 125 FIGURE 2-20: Mode Input Voltage / / OUT DD 125°C 85°C 25°C -40°C Power Supply Voltage (V) Supply Current vs. Power 2.5V DD Common Mode Input Voltage (V) Supply Current vs. Common 2009-2011 Microchip Technology Inc. ...

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... -50 - Ambient Temperature (°C) FIGURE 2-23: Gain Bandwidth Product and Phase Margin vs. Ambient Temperature. 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 2.5V to 5.5V GND GBWP 20 1M 10M 1.E6 1.E7 FIGURE 2-24: and Phase Margin vs. Common Mode Input Voltage ...

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... 1.0E-09 1.E FIGURE 2-28: Separation vs. Frequency / / OUT 100 V 100 k 10k 100k 1M 10M 1.E04 1.E05 1.E06 1.E07 Frequency (Hz) Channel-to-Channel 2009-2011 Microchip Technology Inc. ...

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... 5. MHz 0 Common Mode Input Voltage (V) FIGURE 2-31: Input Noise Voltage Density vs. Input Common Mode Voltage with MHz. 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 25° 2.5V to 5.5V Representative Part -10 Analog NPBW 0.1 Hz ...

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... 5. OUT Time (µs) Inverting Large Signal Step OUT Time (ms) The MCP631/2/3/4 100 125 Ambient Temperature (°C) Slew Rate vs. Ambient 2009-2011 Microchip Technology Inc. ...

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... / k and 5. 2. 0.1 100k 1M 10M 1.E05 1.E06 1.E07 Frequency (Hz) FIGURE 2-40: Maximum Output Voltage Swing vs. Frequency. 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 2.5V to 5.5V GND 100M 1.E / /2, DD OUT DD DS22197B-page 15 ...

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... OUT 5. 2. 100 125 Ambient Temperature (°C) CS Hysteresis vs. Ambient 100 125 Ambient Temperature (°C) CS Turn On Time vs. Representative Part - 100 125 Ambient Temperature (°C) CSs Pull-down Resistor 2009-2011 Microchip Technology Inc. ...

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... and 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 -40°C -1.4 25°C -1.6 85°C 125°C -1.8 -2.0 -2.2 Power Supply Voltage (V) FIGURE 2-47: Quiescent Current in Shutdown vs. Power Supply Voltage. 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 2.5V to 5.5V GND 1.E-06 1µ 5. 1.E-07 100n 10n 1.E-08 1n 1.E-09 100p 1.E-10 10p 1.E-11 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 FIGURE 2-48: Output Voltage ...

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... MCP631/2/3/4/5/9 NOTES: DS22197B-page 18 2009-2011 Microchip Technology Inc. ...

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... Analog Outputs The analog output pins (V ) are low-impedance OUT voltage sources. 3.2 Analog Inputs The non-inverting and inverting inputs (V are high-impedance CMOS inputs with low bias currents. 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 3- ...

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... V pin; they must be SS connected to the same potential on the printed circuit board (PCB). This pad can be connected to a PCB ground plane to provide a larger heat sink. This improves the package thermal resistance ( DS22197B-page 20 2009-2011 Microchip Technology Inc. ...

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... V -) from going too far above and dump any currents onto V DD implemented as shown, resistors R and R 1 the current through D and 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5 > > 2 input voltage FIGURE 4-2: Inputs also possible to connect the diodes to the left of the ...

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... halfway between V and V OUT DD LG and max (V – – 4 SER L ) can be calculated J ), the package A ) found in Table 1-4, and the JA  ( OAmax JA  2009-2011 Microchip Technology Inc. or ...

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... L MCP63X R N FIGURE 4-6: Output Resistor, R stabilizes large capacitive loads. 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 Figure 4-7 gives recommended R different capacitive loads and gains. The x-axis is the normalized load capacitance (C circuits noise gain. For non-inverting gains, G Signal Gain are equal. For inverting gains, G 1Signal Gain (e ...

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... SS Figure 1-1, Figure 2-42 and controls op amp B. These 2.5 mA/amplifier (typical) and µA/amplifier (typical). The I seen the Q will be 2 µA, 2 for single supply) should have a local DD will help you achieve the 2009-2011 Microchip Technology Inc ...

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... 100 nA 30pF MCP63X FIGURE 4-11: Trans-impedance Amplifier for an Optical Detector. 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 4.7.3 H-BRIDGE DRIVER Figure 4-12 shows the MCP632 dual op amp used as a H-bridge driver. The load could be a speaker motor FIGURE 4-12: ...

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... AN990: Analog Sensor Conditioning Circuits An Overview, DS00990 AN1228: Op Amp Precision Design: Random Noise, DS01228 Some of these application notes, and others, are listed in the design guide: Signal Chain Design Guide, DS21825 2009-2011 Microchip Technology Inc. Microchip web site at ...

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... Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 Device Code MCP632 ...

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... MCP631/2/3/4/5/9 Package Marking Information (Continued) 8-Lead TDFN ( (MCP631) 10-Lead DFN (3x3) (MCP635) 10-Lead MSOP (MCP635) 14-Lead SOIC (.150) (MCP634) Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week 01) ...

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... Package Marking Information (Continued) 14-Lead TSSOP (MCP634) XXXXXXXX YYWW NNN 16-Lead QFN (4x4) (MCP639) PIN 1 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week 01) NNN Alphanumeric traceability code ...

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... MCP631/2/3/4/5 DS22197B-page φ 2009-2011 Microchip Technology Inc. ...

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... Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 31 ...

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... MCP631/2/3/4/5/9 N PIN LASER MARK DS22197B-page φ 2009-2011 Microchip Technology Inc. ...

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... Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 33 ...

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... MCP631/2/3/4/5/9 DS22197B-page 34 2009-2011 Microchip Technology Inc. ...

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... Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 35 ...

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... MCP631/2/3/4/5/9 DS22197B-page 36 2009-2011 Microchip Technology Inc. ...

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... Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 37 ...

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... MCP631/2/3/4/5/9 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22197B-page 38 2009-2011 Microchip Technology Inc. ...

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... Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 39 ...

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... MCP631/2/3/4/5/9 DS22197B-page 40 2009-2011 Microchip Technology Inc. ...

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... Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 41 ...

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... MCP631/2/3/4/5/9 DS22197B-page 42 2009-2011 Microchip Technology Inc. ...

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... Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 43 ...

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... MCP631/2/3/4/5/9 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22197B-page 44 2009-2011 Microchip Technology Inc. ...

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... Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 45 ...

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... MCP631/2/3/4/5 NOTE DS22197B-page 2009-2011 Microchip Technology Inc. φ ...

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... Plastic Micro Small Outline Package (UN) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 47 ...

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... MCP631/2/3/4/5/9 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22197B-page 48 2009-2011 Microchip Technology Inc. ...

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... Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 49 ...

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... MCP631/2/3/4/5/9 DS22197B-page 50 2009-2011 Microchip Technology Inc. ...

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... Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 51 ...

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... MCP631/2/3/4/5/9 DS22197B-page 52 2009-2011 Microchip Technology Inc. ...

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... Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 53 ...

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... MCP631/2/3/4/5 TOP VIEW A A1 DS22197B-page 54 EXPOSED PAD NOTE 1 BOTTOM VIEW 2009-2011 Microchip Technology Inc. ...

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... Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2011 Microchip Technology Inc. MCP631/2/3/4/5/9 DS22197B-page 55 ...

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... MCP631/2/3/4/5/9 NOTES: DS22197B-page 56 2009-2011 Microchip Technology Inc. ...

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... MCP631, SOT23 (6L) package option for MCP633, 4x4 QFN (16L) package option for MCP639, SOIC and TSSOP (14L) package options for MCP634 and the related information throughout the document. Updated package types drawing with pin designation for each new package. ...

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... MCP631/2/3/4/5/9 NOTES: DS22197B-page 58 2009-2011 Microchip Technology Inc. ...

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... MCP633T-E/SN: Tape and Reel Extended temperature, 8LD SOIC package g) MCP633T-E/CHY: Tape and Reel Extended temperature, 6LD SOT package h) MCP634T-E/SL: Tape and Reel Extended temperature, 14LD SOIC package i) MCP634T-E/ST: Tape and Reel Extended temperature, 14LD TSSOP package j) MCP635T-E/MF: Tape and Reel ...

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... MCP631/2/3/4/5/9 NOTES: DS22197B-page 60 2009-2011 Microchip Technology Inc. ...

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... Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009-2011, Microchip Technology Incorporated, Printed in the U ...

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... Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-330-9305 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 2009-2011 Microchip Technology Inc. 08/02/11 ...

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